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The Company NVM (Non Volatile Memory) Process Technology Development group is responsible for developing state of the art NVM memory technologies like 3D-NAND & 3D-Xpoint. As an NVM collateral development engineer, you will be responsibilities will be in the areas of initial tape-out reviews, verification of design rules, generation of rules, or model-based mask flows and mask-ready data, and verification of this data to DRs or fab needs. The final goal is alignment between Litho process, mask and OPC to deliver the right patterns on the wafer. The specific functions of lead OPC engineer are to define OPC solutions for new layers or pushed design rules on new nodes including illumination, SMO, resist models, etch models, target layer definition, OPC recipes, OPC checking and then fab verification.
PhD and at least 5 years relevant experience or MS and 8 years relevant experience
Knowledge of semiconductor device and layout.
Basic knowledge of device physics and parametric analysis.
Basic knowledge of photolithography and reticle creation.
In depth knowledge of OPC and manipulation of incoming data to create mask images to construct desired shapes in resist on silicon wafers
Knowledge of CAD tools and software such as Mentor, Cadence, and Synopsys tools
Knowledge of wafer fab processes with focus on Litho module and optimizing illumination details to design rules and OPC.
Familiarity with Tapeout, OPC and Mask Generation Flows for High volume manufacturing.
Proficiency and expertise in standard programming languages such as Perl, Python, MySQL or any other languages like C, C++ in Linux.
Proficiency in Linux operating systems and batch job controls and monitoring.
Demonstrated ability to produce effective, efficient and flexible code to spec along with user interfaces and documentation.
Good verbal & written communication skills with Excel, Visio & Power Point proficiency.
Inside this Business Group
Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....
USExperienced HireJR0129032Santa Clara
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